Wafer Bonding Welder Head from China
This precision welding head is designed for bonding semiconductor wafers during fabrication processes, ensuring hermetic seals without damaging delicate structures. It falls under HTS 8468.90.50.00 as a part of machinery for soldering, brazing, or welding specifically used in semiconductor manufacturing equipment. Its compatibility with vacuum environments makes it ideal for advanced chip packaging.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Verify compatibility with statistical note provisions for semiconductor equipment via CBP rulings; include detailed technical specs and end-use certificates in documentation
• Common pitfall: misclassification as general welding parts without semiconductor context