Other
Machinery and apparatus for soldering, brazing or welding, whether or not capable of cutting, other than those of heading 8515; gas-operated surface tempering machines and appliances; parts thereof: > Parts: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Products classified under HTS 8468.90.50.00
Plasma Welding Gun for Wafer Polishers
Plasma arc welding gun replacement for maintaining wafer polishers that achieve critical surface flatness for fabrication. Falls under HTS 8468.90.50.00 as welding machinery parts for statistical note semiconductor equipment. Optimized for minimal heat-affected zones.
Wafer Bonding Welder Head
This precision welding head is designed for bonding semiconductor wafers during fabrication processes, ensuring hermetic seals without damaging delicate structures. It falls under HTS 8468.90.50.00 as a part of machinery for soldering, brazing, or welding specifically used in semiconductor manufacturing equipment. Its compatibility with vacuum environments makes it ideal for advanced chip packaging.
Laser Welding Torch Assembly for Wafer Slicers
A specialized torch assembly for laser welding components in wafer slicing saw maintenance, used to repair or assemble precision saw blades in semiconductor boule processing. Classified under HTS 8468.90.50.00 as parts of welding machinery tailored for semiconductor wafer preparation equipment. Ensures minimal thermal distortion critical for crystal integrity.
Crystal Puller Brazing Nozzle Kit
Replacement nozzle kit for brazing joints in Czochralski crystal pullers, used to grow monocrystalline silicon boules for semiconductor wafers. Fits HTS 8468.90.50.00 as parts of brazing apparatus in semiconductor crystal growth equipment per statistical note (a)(i). High-temperature resistance prevents contamination during boule pulling.
Wafer Grinder Welding Electrode Holder
Electrode holder for arc welding repairs on wafer grinders, lappers, and polishers used to achieve flatness tolerances in semiconductor wafer preparation. Under HTS 8468.90.50.00 as welding parts for equipment listed in statistical note (a)(ii)(C). Precision design accommodates sub-micron surface requirements.
Semiconductor Wafer Edge Welding Clamp
Custom clamp for soldering wafer edges during processing into devices, compatible with float zone crystal growers. Classified in HTS 8468.90.50.00 for soldering parts in semiconductor equipment per statistical notes. Provides uniform pressure for defect-free bonds.
Boule Grinder Brazing Torch Tip
Tungsten torch tip for brazing repairs on crystal grinders that shape semiconductor boules to precise diameters. HTS 8468.90.50.00 applies as brazing part for wafer prep equipment in statistical note (a)(ii)(A). Corrosion-resistant for cleanroom use.
Crystal Slicer Welding Frame Assembly
Stainless steel frame for soldering diamond blades onto wafer slicing saws used in boule slicing. HTS 8468.90.50.00 for soldering parts in statistical note (a)(ii)(B) equipment. Ensures alignment for thin kerf cuts.
Monocrystalline Boule Welder Power Supply Module
Power module for resistance welding systems in monocrystalline boule grinders, controlling current for precise flats indicating conductivity. Under HTS 8468.90.50.00 as welding parts for statistical note (a)(ii)(A). Stabilizes output for resistivity accuracy.
Gallium Arsenide Wafer Solder Fixture
Fixture for soldering GaAs wafers in device processing, compatible with crystal growers for compound semiconductors. HTS 8468.90.50.00 per statistical notes covering gallium arsenide materials. Thermal management prevents cracking.