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8468.80.50.00/Semiconductor Wafer Slicing Saw/Japan

Semiconductor Wafer Slicing Saw from Japan

High-precision diamond wire or blade saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. Critical for wafer preparation in device fabrication. Classified in HTS 8468.80.5000 as specialized cutting apparatus integral to semiconductor processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Provide wafer thickness tolerance specs (<50 microns typical); obtain semiconductor fab end-user letters

• Pitfall: saws without wire tech may go to general saws in 8461

Semiconductor Wafer Slicing Saw from Japan — Import Duty Rate | HTS 8468.80.50.00