Semiconductor Wafer Slicing Saw from Germany
High-precision diamond wire or blade saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. Critical for wafer preparation in device fabrication. Classified in HTS 8468.80.5000 as specialized cutting apparatus integral to semiconductor processing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide wafer thickness tolerance specs (<50 microns typical); obtain semiconductor fab end-user letters
• Pitfall: saws without wire tech may go to general saws in 8461