Semiconductor Wafer Slicing Saw from Canada
High-precision diamond wire or blade saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. Critical for wafer preparation in device fabrication. Classified in HTS 8468.80.5000 as specialized cutting apparatus integral to semiconductor processing.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Provide wafer thickness tolerance specs (<50 microns typical); obtain semiconductor fab end-user letters
• Pitfall: saws without wire tech may go to general saws in 8461