Semiconductor Wafer Polisher from Mexico
Chemical-mechanical planarization (CMP) polisher for final surface finishing of semiconductor wafers, achieving mirror-like flatness for circuit fabrication. Uses polishing pads and slurries. HTS 8468.80.5000 applies to this critical apparatus in wafer preparation.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include CMP slurry recipes and pad pressure controls in filings; comply with cleanroom certs
• Pitfall: classifying as general polishers increases duties under 8460