8468.80.50.00/Semiconductor Wafer Polisher/Japan

Semiconductor Wafer Polisher from Japan

Chemical-mechanical planarization (CMP) polisher for final surface finishing of semiconductor wafers, achieving mirror-like flatness for circuit fabrication. Uses polishing pads and slurries. HTS 8468.80.5000 applies to this critical apparatus in wafer preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include CMP slurry recipes and pad pressure controls in filings; comply with cleanroom certs

• Pitfall: classifying as general polishers increases duties under 8460