Semiconductor Wafer Polisher from Germany
Chemical-mechanical planarization (CMP) polisher for final surface finishing of semiconductor wafers, achieving mirror-like flatness for circuit fabrication. Uses polishing pads and slurries. HTS 8468.80.5000 applies to this critical apparatus in wafer preparation.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include CMP slurry recipes and pad pressure controls in filings; comply with cleanroom certs
• Pitfall: classifying as general polishers increases duties under 8460