Semiconductor Wafer Polisher from Canada
Chemical-mechanical planarization (CMP) polisher for final surface finishing of semiconductor wafers, achieving mirror-like flatness for circuit fabrication. Uses polishing pads and slurries. HTS 8468.80.5000 applies to this critical apparatus in wafer preparation.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Include CMP slurry recipes and pad pressure controls in filings; comply with cleanroom certs
• Pitfall: classifying as general polishers increases duties under 8460