Multi-Wire Wafer Slicer from Mexico
Diamond multi-wire saw for simultaneous slicing of hundreds of semiconductor wafers from a single boule, minimizing material waste. High-speed for production volumes. Classified under HTS 8468.80.5000 as advanced cutting machinery for semiconductor wafers.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Wire tension and diamond embedding specs required; high value needs insurance
• Common error: classifying as textile wire saws