Multi-Wire Wafer Slicer from Japan
Diamond multi-wire saw for simultaneous slicing of hundreds of semiconductor wafers from a single boule, minimizing material waste. High-speed for production volumes. Classified under HTS 8468.80.5000 as advanced cutting machinery for semiconductor wafers.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Wire tension and diamond embedding specs required; high value needs insurance
• Common error: classifying as textile wire saws