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8468.80.50.00/Multi-Wire Wafer Slicer/Germany

Multi-Wire Wafer Slicer from Germany

Diamond multi-wire saw for simultaneous slicing of hundreds of semiconductor wafers from a single boule, minimizing material waste. High-speed for production volumes. Classified under HTS 8468.80.5000 as advanced cutting machinery for semiconductor wafers.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Wire tension and diamond embedding specs required; high value needs insurance

• Common error: classifying as textile wire saws

Multi-Wire Wafer Slicer from Germany — Import Duty Rate | HTS 8468.80.50.00