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8468.80.50.00/High-Purity Silicon Wafer Edge Grinder/Japan

High-Purity Silicon Wafer Edge Grinder from Japan

Edge profiling grinder for semiconductor wafers to prevent chipping and enable handling, creating chamfers with specific radii. Post-slicing essential. Classified HTS 8468.80.5000 as wafer processing apparatus.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Chamfer angle specs; yield improvement data helpful

• Avoid 8460 by proving wafer fragility handling

High-Purity Silicon Wafer Edge Grinder from Japan — Import Duty Rate | HTS 8468.80.50.00