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8468.80.50.00/Double-Sided Wafer Lapper/Mexico

Double-Sided Wafer Lapper from Mexico

Machine for simultaneous lapping of both wafer sides using planetary motion carriers, achieving total thickness variation (TTV) under 1 micron. Vital for advanced nodes. HTS 8468.80.5000 for precision semiconductor surface apparatus.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• TTV measurement protocols essential; cleanroom packaging mandatory

• Pitfall: single-side lappers may differ in subheading

Double-Sided Wafer Lapper from Mexico — Import Duty Rate | HTS 8468.80.50.00