8468.80.50.00/Double-Sided Wafer Lapper/Mexico

Double-Sided Wafer Lapper from Mexico

Machine for simultaneous lapping of both wafer sides using planetary motion carriers, achieving total thickness variation (TTV) under 1 micron. Vital for advanced nodes. HTS 8468.80.5000 for precision semiconductor surface apparatus.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• TTV measurement protocols essential; cleanroom packaging mandatory

• Pitfall: single-side lappers may differ in subheading

Double-Sided Wafer Lapper from Mexico — Import Duty Rate | HTS 8468.80.50.00