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8468.80.50.00/Double-Sided Wafer Lapper/Japan

Double-Sided Wafer Lapper from Japan

Machine for simultaneous lapping of both wafer sides using planetary motion carriers, achieving total thickness variation (TTV) under 1 micron. Vital for advanced nodes. HTS 8468.80.5000 for precision semiconductor surface apparatus.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• TTV measurement protocols essential; cleanroom packaging mandatory

• Pitfall: single-side lappers may differ in subheading