Double-Sided Wafer Lapper from Canada
Machine for simultaneous lapping of both wafer sides using planetary motion carriers, achieving total thickness variation (TTV) under 1 micron. Vital for advanced nodes. HTS 8468.80.5000 for precision semiconductor surface apparatus.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• TTV measurement protocols essential; cleanroom packaging mandatory
• Pitfall: single-side lappers may differ in subheading