Double-Sided Wafer Lapper from Canada
Machine for simultaneous lapping of both wafer sides using planetary motion carriers, achieving total thickness variation (TTV) under 1 micron. Vital for advanced nodes. HTS 8468.80.5000 for precision semiconductor surface apparatus.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• TTV measurement protocols essential; cleanroom packaging mandatory
• Pitfall: single-side lappers may differ in subheading