Crystal Boule Grinder from Japan
Precision grinder for semiconductor crystal boules, shaping to exact wafer diameters and grinding flats to indicate conductivity type and resistivity. Essential wafer preparation equipment post-growth. HTS 8468.80.5000 covers it as specialized grinding apparatus in semiconductor processing chain.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document flat-grinding specs for resistivity indication to prove semiconductor use; check for anti-dumping on precision grinders
• Avoid pitfall of classifying as general metalworking machinery