Crystal Boule Grinder from Japan
Precision grinder for semiconductor crystal boules, shaping to exact wafer diameters and grinding flats to indicate conductivity type and resistivity. Essential wafer preparation equipment post-growth. HTS 8468.80.5000 covers it as specialized grinding apparatus in semiconductor processing chain.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document flat-grinding specs for resistivity indication to prove semiconductor use; check for anti-dumping on precision grinders
• Avoid pitfall of classifying as general metalworking machinery