Chemical Mechanical Wafer Polisher from Japan
CMP polisher with integrated slurry dispense and endpoint detection for uniform planarization across 300mm semiconductor wafers. Used in front-end processing. Under HTS 8468.80.5000 as specialized polishing apparatus.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Endpoint detection tech details; chemical handling certs needed
• High duties if misclassified as lab equipment