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8468.80.50.00/Chemical Mechanical Wafer Polisher/Japan

Chemical Mechanical Wafer Polisher from Japan

CMP polisher with integrated slurry dispense and endpoint detection for uniform planarization across 300mm semiconductor wafers. Used in front-end processing. Under HTS 8468.80.5000 as specialized polishing apparatus.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Endpoint detection tech details; chemical handling certs needed

• High duties if misclassified as lab equipment

Chemical Mechanical Wafer Polisher from Japan — Import Duty Rate | HTS 8468.80.50.00