Chemical Mechanical Wafer Polisher from Germany
CMP polisher with integrated slurry dispense and endpoint detection for uniform planarization across 300mm semiconductor wafers. Used in front-end processing. Under HTS 8468.80.5000 as specialized polishing apparatus.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Endpoint detection tech details; chemical handling certs needed
• High duties if misclassified as lab equipment