Chemical Mechanical Wafer Polisher from Canada
CMP polisher with integrated slurry dispense and endpoint detection for uniform planarization across 300mm semiconductor wafers. Used in front-end processing. Under HTS 8468.80.5000 as specialized polishing apparatus.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Endpoint detection tech details; chemical handling certs needed
• High duties if misclassified as lab equipment