Boule Diameter Grinder from Mexico
Precision grinder specifically for reducing semiconductor boule diameter to standard wafer sizes (e.g., 300mm) while maintaining roundness. Includes automated gauging. HTS 8468.80.5000 for semiconductor-specific grinding apparatus.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Gauge resolution docs (<1 micron) key; pair with boule handling systems
• Pitfall: standalone grinders may default to 8460