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8468.80.50.00/Boule Diameter Grinder/Japan

Boule Diameter Grinder from Japan

Precision grinder specifically for reducing semiconductor boule diameter to standard wafer sizes (e.g., 300mm) while maintaining roundness. Includes automated gauging. HTS 8468.80.5000 for semiconductor-specific grinding apparatus.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Gauge resolution docs (<1 micron) key; pair with boule handling systems

• Pitfall: standalone grinders may default to 8460

Boule Diameter Grinder from Japan — Import Duty Rate | HTS 8468.80.50.00