Boule Diameter Grinder from Japan
Precision grinder specifically for reducing semiconductor boule diameter to standard wafer sizes (e.g., 300mm) while maintaining roundness. Includes automated gauging. HTS 8468.80.5000 for semiconductor-specific grinding apparatus.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Gauge resolution docs (<1 micron) key; pair with boule handling systems
• Pitfall: standalone grinders may default to 8460