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8468.80.50.00/Automated Wafer Grinder for Backside/Japan

Automated Wafer Grinder for Backside from Japan

Back-grinding machine reducing semiconductor wafer thickness from 775 microns to <100 microns for 3D packaging, with tape mounting. Production critical. HTS 8468.80.5000 covers grinding in semiconductor workflow.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Thickness uniformity data; tape compatibility

• Pitfall: thickness measurement tools may separate to 9031