8468.80.50.00/Automated Wafer Grinder for Backside/Japan

Automated Wafer Grinder for Backside from Japan

Back-grinding machine reducing semiconductor wafer thickness from 775 microns to <100 microns for 3D packaging, with tape mounting. Production critical. HTS 8468.80.5000 covers grinding in semiconductor workflow.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Thickness uniformity data; tape compatibility

• Pitfall: thickness measurement tools may separate to 9031

Automated Wafer Grinder for Backside from Japan — Import Duty Rate | HTS 8468.80.50.00