Automated Wafer Grinder for Backside from Germany
Back-grinding machine reducing semiconductor wafer thickness from 775 microns to <100 microns for 3D packaging, with tape mounting. Production critical. HTS 8468.80.5000 covers grinding in semiconductor workflow.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Thickness uniformity data; tape compatibility
• Pitfall: thickness measurement tools may separate to 9031