</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8468.80.50.00/Automated Wafer Grinder for Backside/Germany

Automated Wafer Grinder for Backside from Germany

Back-grinding machine reducing semiconductor wafer thickness from 775 microns to <100 microns for 3D packaging, with tape mounting. Production critical. HTS 8468.80.5000 covers grinding in semiconductor workflow.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Calculate with your customs valueVerify classification with AI

Import Tips

• Thickness uniformity data; tape compatibility

• Pitfall: thickness measurement tools may separate to 9031