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Pneumatic Wafer Slicing Saw Arbor from Japan

Pneumatic arbor shaft for diamond wafer slicing saws that cut monocrystalline boules into thin wafers, a hand tool part under HTS 8467.99.0190 for semiconductor processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Import Tips

Specify diamond blade compatibility and RPM ratings; comply with OSHA safety standards for import; beware of classification as knife parts if not pneumatic