Pneumatic Wafer Slicing Saw Arbor from Japan
Pneumatic arbor shaft for diamond wafer slicing saws that cut monocrystalline boules into thin wafers, a hand tool part under HTS 8467.99.0190 for semiconductor processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify diamond blade compatibility and RPM ratings; comply with OSHA safety standards for import; beware of classification as knife parts if not pneumatic