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8467.99.01.90/Pneumatic Wafer Edge Profiling Nozzle/Japan

Pneumatic Wafer Edge Profiling Nozzle from Japan

Pneumatic nozzle for edge profiling tools that shape wafer edges post-slicing for semiconductor handling, HTS 8467.99.0190 part.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify airflow and particle-free materials; cleanroom certification aids customs; pitfall: classifying as spray nozzles