8467.89.50/Pneumatic Wafer Slicing Assist Tool/Japan

Pneumatic Wafer Slicing Assist Tool from Japan

Pneumatic handheld guide and trimmer used alongside saws for precise wafer slicing from crystal boules. Falls under HTS 8467.89.50 as other pneumatic hand tools for semiconductor material processing. Aids in maintaining wafer integrity during boule slicing.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Pair with slicing saw invoices to show complementary semiconductor use

• High-precision air fittings require cleanroom certification documentation

Pneumatic Wafer Slicing Assist Tool from Japan — Import Duty Rate | HTS 8467.89.50