Pneumatic Crystal Grinder from Japan
A handheld pneumatic tool used to grind semiconductor crystal boules to precise diameters for wafer production. It falls under HTS 8467.89.50 as a pneumatic hand tool for specialized material processing in semiconductor manufacturing. Designed for high-precision work on monocrystalline materials like silicon.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Verify tool meets pneumatic hand tool specs per Chapter 84 notes; provide technical specs showing semiconductor use
• Include end-use certificates for semiconductor manufacturing to avoid misclassification as general grinding tools