Hydraulic Hand Wafer Grinder from Mexico
Portable hydraulic grinder for initial wafer thickness reduction after slicing. HTS 8467.89.50 hydraulic hand tool for semiconductor wafer grinders.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Hydraulic fluid specs (cleanroom grade) mandatory
• Weight limits for 'hand tool' classification
• Avoid combining with saws in one entry