8467.89.50/Hydraulic Hand Wafer Grinder/Japan

Hydraulic Hand Wafer Grinder from Japan

Portable hydraulic grinder for initial wafer thickness reduction after slicing. HTS 8467.89.50 hydraulic hand tool for semiconductor wafer grinders.

Duty Rate — Japan → United States

25%

Rate breakdown

9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter

9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)

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Import Tips

• Hydraulic fluid specs (cleanroom grade) mandatory

• Weight limits for 'hand tool' classification

• Avoid combining with saws in one entry