Pneumatic Wafer Polishing Pencil from Japan
Precision pneumatic hand tool resembling a pencil for final polishing of semiconductor wafer surfaces before fabrication. Falls under HTS 8467.89.50.90 as other pneumatic tools for wafer polishers in semiconductor processing. Achieves mirror finish for device yield.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Include polishing media specs in documentation; distinguish from jewelry polishers
• Customs often questions handheld precision claims—provide fab usage proof
• Abrasive compliance needed