Hydraulic Wafer Lapping Tool from Japan
Handheld hydraulic tool for lapping semiconductor wafers to achieve surface flatness within strict tolerances for device fabrication. HTS 8467.89.50.90 covers hydraulic hand tools used in wafer preparation per statistical notes. Critical for removing material precisely.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Document hydraulic pressure ratings and wafer compatibility; prone to reclassification as industrial machinery
• Require end-use statement for semiconductor fabs
• Check for hydraulic fluid containment compliance