Electric Wafer Surface Profiler from Japan
Handheld electric tool for profiling wafer surfaces to verify flatness post-lapping in semiconductor prep. Classified HTS 8467.89.50.90 as electric hand tool for wafer grinders/lappers. Critical quality control step.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Surface finish specs (angstrom level) in docs; distinguish from CMMs
• Cleanroom class certification
• Avoid Chapter 90 testing shift