Cordless Semiconductor Wafer Deburrer from Japan
Battery-operated handheld deburring tool specifically for removing burrs from sliced semiconductor wafers. Falls under HTS 8467.89.50.90 as self-contained electric tool for wafer preparation equipment. Prevents contamination in fab processes.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Static dissipative materials proof needed for cleanrooms; ESD certification
• Distinguish from metalworking tools via wafer specs
• Battery disposal regs apply