Cordless Semiconductor Wafer Deburrer from Japan
Battery-operated handheld deburring tool specifically for removing burrs from sliced semiconductor wafers. Falls under HTS 8467.89.50.90 as self-contained electric tool for wafer preparation equipment. Prevents contamination in fab processes.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Static dissipative materials proof needed for cleanrooms; ESD certification
• Distinguish from metalworking tools via wafer specs
• Battery disposal regs apply