Battery-Powered Wafer Slicing Guide Tool from Japan
Self-contained electric handheld guide ensuring precise alignment during wafer slicing from semiconductor boules. Classified HTS 8467.89.50.90 as other electric hand tools for wafer slicing saws. Maintains cut parallelism.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Demonstrate non-standalone use with slicing saws; lithium battery transport regs apply
• Common error: consumer power tool declaration
• Semiconductor end-use verification crucial