Pneumatic Wafer Slicing Pneumatic Saw from Mexico
Hand-held pneumatic saw used to slice thin wafers from monocrystalline semiconductor boules in wafer preparation. Classified under HTS 8467.19.50.90 as other pneumatic hand tools for semiconductor material processing. Precision blade ensures minimal kerf loss for high-yield wafer production.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Include detailed blueprints showing diamond wire or blade specs for wafer slicing to confirm classification and avoid reclassification as industrial saws
• Document cleanroom compatibility and vibration control features, as these are key for semiconductor use and customs verification