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8467.19.50.90/Hand Pneumatic Wafer Surface Lapper/Mexico

Hand Pneumatic Wafer Surface Lapper from Mexico

Pneumatic handheld lapper for semiconductor wafer surface flattening before polishing steps. Fits HTS 8467.19.50.90 as wafer preparation equipment tool. Achieves sub-micron flatness for device fabrication.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Detail lap plate flatness tolerance (<1um) in specs

• Pair with slurry SDS for hazmat compliance

• Don't import loose laps; classify as sets