8467.19.50.90/Hand Pneumatic Wafer Surface Lapper/Japan

Hand Pneumatic Wafer Surface Lapper from Japan

Pneumatic handheld lapper for semiconductor wafer surface flattening before polishing steps. Fits HTS 8467.19.50.90 as wafer preparation equipment tool. Achieves sub-micron flatness for device fabrication.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Detail lap plate flatness tolerance (<1um) in specs

• Pair with slurry SDS for hazmat compliance

• Don't import loose laps; classify as sets