Hand Pneumatic Wafer Surface Lapper from Canada
Pneumatic handheld lapper for semiconductor wafer surface flattening before polishing steps. Fits HTS 8467.19.50.90 as wafer preparation equipment tool. Achieves sub-micron flatness for device fabrication.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Detail lap plate flatness tolerance (<1um) in specs
• Pair with slurry SDS for hazmat compliance
• Don't import loose laps; classify as sets