</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8466.94.85.85/Wafer Slicing Saw Arbor/Mexico

Wafer Slicing Saw Arbor from Mexico

Diamond-impregnated arbor for wafer slicing saws under heading 8463, used to slice monocrystalline boules into wafers. Classified in 8466.94.85.85 as special attachment for 8463 sawing machines. Meets tolerances for semiconductor wafer thickness per statistical notes.

Duty Rate — Mexico → United States

14.7%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify diamond grit size and kerf width suitable only for semiconductor wafers on entry docs

• Include runout tolerance specs (<1 micron) to prove machine tool classification

Wafer Slicing Saw Arbor from Mexico — Import Duty Rate | HTS 8466.94.85.85