8466.94.85.85/Wafer Slicing Saw Arbor/Japan

Wafer Slicing Saw Arbor from Japan

Diamond-impregnated arbor for wafer slicing saws under heading 8463, used to slice monocrystalline boules into wafers. Classified in 8466.94.85.85 as special attachment for 8463 sawing machines. Meets tolerances for semiconductor wafer thickness per statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify diamond grit size and kerf width suitable only for semiconductor wafers on entry docs

• Include runout tolerance specs (<1 micron) to prove machine tool classification