Wafer Slicing Saw Arbor from Japan
Diamond-impregnated arbor for wafer slicing saws under heading 8463, used to slice monocrystalline boules into wafers. Classified in 8466.94.85.85 as special attachment for 8463 sawing machines. Meets tolerances for semiconductor wafer thickness per statistical notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify diamond grit size and kerf width suitable only for semiconductor wafers on entry docs
• Include runout tolerance specs (<1 micron) to prove machine tool classification