8466.94.85.85/Wafer Polisher Quill Assembly/Mexico

Wafer Polisher Quill Assembly from Mexico

Quill/spindle assembly for wafer polishers bringing surfaces to semiconductor fabrication tolerances. For heading 8463 polishing machines, classified 8466.94.85.85. Critical for flatness specs in statistical note wafer preparation equipment.

Duty Rate — Mexico → United States

14.7%

Rate breakdown

9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter

Calculate with your customs value Verify with the Tariff Assistant

Import Tips

• Specify polishing pad interface dimensions unique to semiconductor polishers

• Include cleanroom compatibility certifications (ISO Class 1) in import docs

• Avoid bundling with polishing slurry delivery systems which may classify differently