8466.94.85.85/Wafer Polisher Quill Assembly/Japan

Wafer Polisher Quill Assembly from Japan

Quill/spindle assembly for wafer polishers bringing surfaces to semiconductor fabrication tolerances. For heading 8463 polishing machines, classified 8466.94.85.85. Critical for flatness specs in statistical note wafer preparation equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify polishing pad interface dimensions unique to semiconductor polishers

• Include cleanroom compatibility certifications (ISO Class 1) in import docs

• Avoid bundling with polishing slurry delivery systems which may classify differently