Wafer Polisher Quill Assembly from Japan
Quill/spindle assembly for wafer polishers bringing surfaces to semiconductor fabrication tolerances. For heading 8463 polishing machines, classified 8466.94.85.85. Critical for flatness specs in statistical note wafer preparation equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify polishing pad interface dimensions unique to semiconductor polishers
• Include cleanroom compatibility certifications (ISO Class 1) in import docs
• Avoid bundling with polishing slurry delivery systems which may classify differently