Wafer Polisher Quill Assembly from Germany
Quill/spindle assembly for wafer polishers bringing surfaces to semiconductor fabrication tolerances. For heading 8463 polishing machines, classified 8466.94.85.85. Critical for flatness specs in statistical note wafer preparation equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify polishing pad interface dimensions unique to semiconductor polishers
• Include cleanroom compatibility certifications (ISO Class 1) in import docs
• Avoid bundling with polishing slurry delivery systems which may classify differently