Wafer Grinder Spindle Assembly from Japan
Precision spindle assembly for wafer grinders used in semiconductor boule preparation, compatible with grinding machines of heading 8463. Classified under 8466.94.85.85 as an accessory principally for heading 8463 machines. Critical for achieving flatness tolerances in crystal grinding per statistical notes.
Duty Rate — Japan → United States
14.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide evidence of use in monocrystalline semiconductor boule grinding to support classification
• Include vibration tolerance specs in invoices to demonstrate semiconductor-grade precision
• Watch for anti-dumping duties on precision bearings commonly incorporated in these assemblies