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8466.94.85.85/Dividing Head for Wafer Machines/Mexico

Dividing Head for Wafer Machines from Mexico

Precision dividing head for indexing in multi-axis wafer grinding machines under heading 8462/8463. HTS 8466.94.85.85 covers this special attachment for machine tools. Enables complex angular positioning for semiconductor boule preparation.

Duty Rate — Mexico → United States

14.7%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Include division plate specifications showing sub-arcsecond accuracy for classification support

• Declare end-use in 'semiconductor crystal boule machining' for statistical note alignment

Dividing Head for Wafer Machines from Mexico — Import Duty Rate | HTS 8466.94.85.85