Dividing Head for Wafer Machines from Mexico
Precision dividing head for indexing in multi-axis wafer grinding machines under heading 8462/8463. HTS 8466.94.85.85 covers this special attachment for machine tools. Enables complex angular positioning for semiconductor boule preparation.
Duty Rate — Mexico → United States
14.7%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include division plate specifications showing sub-arcsecond accuracy for classification support
• Declare end-use in 'semiconductor crystal boule machining' for statistical note alignment