8466.94.85.85/Dividing Head for Wafer Machines/Japan

Dividing Head for Wafer Machines from Japan

Precision dividing head for indexing in multi-axis wafer grinding machines under heading 8462/8463. HTS 8466.94.85.85 covers this special attachment for machine tools. Enables complex angular positioning for semiconductor boule preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Calculate with your customs value Verify classification with AI

Import Tips

• Include division plate specifications showing sub-arcsecond accuracy for classification support

• Declare end-use in 'semiconductor crystal boule machining' for statistical note alignment