Dividing Head for Wafer Machines from Germany
Precision dividing head for indexing in multi-axis wafer grinding machines under heading 8462/8463. HTS 8466.94.85.85 covers this special attachment for machine tools. Enables complex angular positioning for semiconductor boule preparation.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include division plate specifications showing sub-arcsecond accuracy for classification support
• Declare end-use in 'semiconductor crystal boule machining' for statistical note alignment