Dividing Head for Wafer Machines from Canada
Precision dividing head for indexing in multi-axis wafer grinding machines under heading 8462/8463. HTS 8466.94.85.85 covers this special attachment for machine tools. Enables complex angular positioning for semiconductor boule preparation.
Duty Rate — Canada → United States
14.7%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Include division plate specifications showing sub-arcsecond accuracy for classification support
• Declare end-use in 'semiconductor crystal boule machining' for statistical note alignment