CNC Grinder Workhead from Japan
Complete workhead assembly for CNC grinding machines of heading 8463 used in wafer lapping/polishing prep. Under HTS 8466.94.85.85 as part principally for 8463 grinders. Provides precise rotational control for semiconductor surface flatness.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Submit OEM part numbers confirming compatibility with identified 8463 grinder models
• Document hydrostatic bearing technology as evidence of semiconductor precision
• Beware of classification disputes with hydraulic/pneumatic components