CNC Grinder Workhead from Japan
Complete workhead assembly for CNC grinding machines of heading 8463 used in wafer lapping/polishing prep. Under HTS 8466.94.85.85 as part principally for 8463 grinders. Provides precise rotational control for semiconductor surface flatness.
Duty Rate — Japan → United States
14.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Submit OEM part numbers confirming compatibility with identified 8463 grinder models
• Document hydrostatic bearing technology as evidence of semiconductor precision
• Beware of classification disputes with hydraulic/pneumatic components